Highly integrated implementation of the optical transceiver allows to achieve:
- Significant reduction of the assembly complexity and size of the module
- Chip area reduction due to monolithic integration of the components
- Built-in testing capabilities during fabrication (on-wafer tests) and during operation
Project targets 25G and 50G multi-channel transceiver for 100G/200G/400G+ optical interfaces
We're looking for investors and interested parties.